Modeling and Application of Flexible Electronics Packaging - Huang - Books - Springer Verlag, Singapore - 9789811336263 - May 7, 2019
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Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition

Huang

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Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.

287 pages, XVII, 287 p.

Media Books     Book
Released May 7, 2019
ISBN13 9789811336263
Publishers Springer Verlag, Singapore
Pages 287
Dimensions 629 g
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