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More-than-Moore 2.5D and 3D SiP Integration Softcover reprint of the original 1st ed. 2017 edition
Riko Radojcic
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More-than-Moore 2.5D and 3D SiP Integration Softcover reprint of the original 1st ed. 2017 edition
Riko Radojcic
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime.
182 pages, 58 Tables, color; 66 Illustrations, color; 2 Illustrations, black and white; XV, 182 p. 6
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | May 4, 2018 |
| ISBN13 | 9783319849324 |
| Publishers | Springer International Publishing AG |
| Pages | 182 |
| Dimensions | 285 g |
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