3D IC Stacking Technology - Banqiu Wu - Books - McGraw-Hill Education - Europe - 9780071741958 - September 16, 2011
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3D IC Stacking Technology Ed edition

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The latest advances in three-dimensional integrated circuit stacking technology


544 pages, illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released September 16, 2011
ISBN13 9780071741958
Publishers McGraw-Hill Education - Europe
Pages 544
Dimensions 237 × 159 × 36 mm   ·   936 g
Language English  

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