Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R - Cheng - Books - Springer Verlag, Singapore - 9789811061646 - September 18, 2017
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition

Cheng

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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.

Media Books     Book
Released September 18, 2017
ISBN13 9789811061646
Publishers Springer Verlag, Singapore
Pages 137
Dimensions 399 g
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