The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages - Gerard Kelly - Books - Springer-Verlag New York Inc. - 9781461372769 - October 8, 2012
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Softcover Reprint of the Original 1st Ed. 1999 edition

Gerard Kelly

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Softcover Reprint of the Original 1st Ed. 1999 edition

153 pages, black & white illustrations, bibliography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 8, 2012
ISBN13 9781461372769
Publishers Springer-Verlag New York Inc.
Pages 134
Dimensions 155 × 235 × 9 mm   ·   235 g

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