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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
192 pages, biography
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | December 3, 2010 |
ISBN13 | 9781441948731 |
Publishers | Springer-Verlag New York Inc. |
Pages | 192 |
Dimensions | 156 × 234 × 11 mm · 299 g |
Editor | Ernst, L.j. |
Editor | Leger, O.de Saint |
Editor | Zhang, G.q |
See all of G Q Zhang ( e.g. Paperback Book )