Materials for Advanced Semiconductor Packaging and Heterogeneous Integration - - Books - Taylor & Francis Ltd - 9781032959436 - October 19, 2026
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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

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This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 19, 2026
ISBN13 9781032959436
Publishers Taylor & Francis Ltd
Pages 472
Dimensions 161 × 242 × 34 mm   ·   880 g
Editor Shangguan, Dongkai

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